HTEC, a global provider of digital product development and engineering services, has announced the acquisition of eesy-innovation, a German and Spanish-based embedded hardware and software engineering company. The acquisition aims to bolster HTEC’s expertise in embedded technology, IoT, and artificial intelligence, supporting the company’s growth strategy and strengthening its presence across Europe, particularly in the DACH region.
Founded in 2008 in Belgrade, HTEC has built a reputation for merging Silicon Valley-inspired design thinking with robust software engineering to deliver end-to-end digital solutions. Headquartered in San Mateo, California, HTEC’s reach extends globally, offering services ranging from initial product strategy and concept development to sophisticated engineering solutions for a wide array of industries. The acquisition of eesy-innovation marks a further step in HTEC’s plan to develop tailored solutions for its clients, bringing in additional expertise to enhance its offerings in embedded systems and smart IoT applications.
Eesy-innovation, founded in Munich in 2015, has quickly risen to prominence for its scalable, cutting-edge solutions that serve various industries, including work with semiconductor giant Infineon Technologies. Known for translating innovative ideas into practical, tailored IoT solutions, eesy-innovation specialises in complete lifecycle management—from concept engineering and embedded hardware to software integration, including cloud services, dashboards, and artificial intelligence algorithms. With operations spanning Munich and Granada, eesy-innovation has earned recognition for enabling the digital transformation of businesses of all sizes.
Darko Todorović, HTEC’s Vice President of Engineering and Delivery, expressed his enthusiasm for the merger, citing the potential for both companies to leverage their combined strengths. “I am thrilled to welcome the eesy-innovation team onboard. This partnership aligns with HTEC’s strategy of expanding our embedded and AI capabilities, particularly as we work with major chip manufacturers like AMD. By joining forces with eesy-innovation, we are broadening our capacity to deliver tailored solutions, drive innovation, and promote AI adoption across multiple sectors. Together, we aim to empower our clients to innovate rapidly in an evolving technological landscape. Having eesy-innovation as part of the HTEC team is a significant milestone.”
The addition of eesy-innovation is expected to provide career growth opportunities for employees across both organisations. Through HTEC’s global network of more than 20 development centres, eesy-innovation’s team will have access to a wider range of professional collaborations, projects, and geographic markets. This expanded network, HTEC believes, will enhance the team’s ability to address complex engineering challenges and deliver innovative solutions to a diverse range of clients, from high-growth startups to established multinational corporations.
Founder of eesy-innovation, Günter Maximilian Hefner, also expressed optimism for the opportunities ahead. “For our team, this acquisition means access to new avenues for professional growth, including working on technically demanding projects in various industries and geographies. Joining forces with HTEC provides a platform for us to collaborate with a broader talent pool and engage in projects that span more than 20 development centres worldwide.”
HTEC’s acquisition of eesy-innovation underscores its commitment to extending its influence within the European market, especially in the DACH region. The integration of both companies’ expertise is anticipated to drive advancements in IoT and AI solutions, contributing to HTEC’s mission to deliver transformative technology for high-tech companies, fast-growing startups, and major global enterprises.
